Hanersun Technology الألواح الشمسية

● TOPCon module technology enables high-power output

● Bigger wafer size and half-cell design ensures greater efficiency (22.37%)

● Multi-busbar enhances current collection with lower series resistance

● Lower operating temperature and temperature coefficient improve power output

● Anti-PID property guarantees better performance in harsh environment

● TOPCon module technology enables high power output (695W)

● Bigger wafer size and half-cell design ensures greater efficiency (22.37%)

● Multi-busbar enhances current collection with lower series resistance

● Lower operating temperature and temperature coefficient improves power output

● Anti-PID property guarantees better performance in harsh environment

● TOPCon module technology enables high power output (695W)

● Bigger wafer size and half-cell design ensures greater efficiency (22.37%)

● Multi-busbar enhances current collection with lower series resistance

● Lower operating temperature and temperature coefficient improves power output

● Anti-PID property guarantees better performance in harsh environment

• TOPCon enables high-power output

• Bigger wafer size and half-cell design ensures greater efficiency (22.65%)

• MBB enhances the current collection with lower series resistance

• Lower operating temp. and temp. coefficient improves power output

• Anti-PID property guarantees better performance in harsh environment

• TOPCon module technology enables high-power output

• Bigger wafer size and half-cell design ensures greater efficiency (22.37%)

• Multi-busbar enhances current collection with lower series resistance

• Lower operating temperature and temperature coefficient improve power output

• The anti-PID property guarantees better performance in harsh environment